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2D & 3D Digital Image Correlation systems

LaVision: 2D & 3D Digital Image Correlation (DIC) Systems

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LaVision’s StrainMaster Portable is an advanced and compact 2D and 3D Digital Image Correlation (DIC) system designed for shape, deformation, and strain analysis. It offers full-field strain measurements, even at very high temperatures, making it a versatile tool for material testing in various applications.

  1. Complete Surface Strain Mapping:

    • Enables detailed strain analysis during standard material tests.
    • Ideal for real-time visualization of deformation.

  2. 2D and 3D Measurement Capabilities:

    • Accurately measures shape, deformation, and strain in two and three dimensions.
    • Suitable for analyzing materials of various sizes.

  3. Portable and Lightweight Design:

    • Compact system for lab and field use.
    • Easy to transport and set up.

  4. High-Performance Imaging Components:

    • Features Imager E-Lite cameras for high-resolution data capture.
    • Includes a cold illumination system to enhance image clarity and reduce interference.

  5. User-Friendly Software:

    • Comprehensive and intuitive software for efficient operation.
    • Fast and accurate data processing for immediate insights.

Category:

Digital Image Correlation (DIC), strain analysis, deformation testing, high-temperature material testing, 2D DIC, 3D DIC, portable DIC systems, LaVision StrainMaster, Imager E-Lite cameras, cold illumination system, material behavior analysis.

LaVision: 2D & 3D Digital Image Correlation (DIC) Systems Overview

LaVision’s 2D & 3D Digital Image Correlation (DIC) Systems are advanced solutions for non-contact, full-field deformation and strain analysis. These systems utilize state-of-the-art optical technology to capture, measure, and analyze surface deformation in two or three dimensions with exceptional precision. DIC technology is widely employed across industries and research fields for evaluating the mechanical behavior of materials and structures under various load conditions.

  1. High Accuracy and Resolution

    • LaVision’s DIC systems deliver high-accuracy measurements of displacements and strains at submicron and sub-pixel levels, ensuring reliable data for critical applications.

  2. 2D and 3D Measurement Capability

    • Offers versatile analysis options:
      • 2D DIC for planar surfaces.
      • 3D DIC for capturing complex geometries and out-of-plane deformations.

  3. Full-Field Data Analysis

    • Provides comprehensive, full-field data visualization of strain, deformation, and displacement, enabling a deeper understanding of material behavior compared to single-point measurements.

  4. Advanced Camera Technology

    • Equipped with high-speed, high-resolution cameras to capture precise details, even during dynamic testing scenarios.

  5. Adaptable Configurations

    • Configurable systems to suit a variety of applications, materials, and environmental conditions, including high-temperature and high-strain-rate testing.

  6. User-Friendly Software

    • LaVision’s dedicated software suite facilitates easy setup, data acquisition, and analysis with features like automated calibration, real-time monitoring, and exportable results.

  7. Non-Contact and Non-Destructive

    • As a non-contact testing method, DIC ensures the integrity of specimens and structures remains intact during the analysis process.
LaVision: 2D & 3D Digital Image Correlation (DIC) Systems Overview

LaVision’s 2D and 3D Digital Image Correlation (DIC) Systems provide a cutting-edge solution for non-contact, full-field deformation measurement and strain analysis. These systems are widely used in materials research, product development, and quality assurance to evaluate material behavior under various mechanical loads. The DIC technology utilizes high-resolution cameras and advanced image processing algorithms to track surface patterns and calculate deformations with exceptional precision.

  • 2D and 3D Measurement Capabilities
    Offers flexibility in measuring planar deformations (2D) and complex 3D displacements and strains for a variety of applications.

  • Non-Contact, Full-Field Analysis
    Eliminates the need for physical sensors, providing a non-intrusive and comprehensive analysis of material deformation across the entire surface.

  • High Accuracy and Resolution
    Utilizes advanced optical imaging and correlation techniques to deliver precise measurements of displacements and strains, even at the microscale.

  • Real-Time Data Acquisition
    Enables live monitoring of deformation and strain during testing, allowing for immediate feedback and analysis.

  • Compatibility with Diverse Testing Scenarios
    Works seamlessly with tensile testing, compression testing, bending tests, fatigue analysis, and high-speed dynamic testing.

  • Robust Image Correlation Algorithms
    Advanced software ensures reliable performance in tracking deformation, even on complex patterns or under challenging conditions.

  • Wide Range of Applications
    Ideal for materials research, aerospace, automotive, biomedical, and manufacturing industries where detailed strain analysis is critical.

  • Customizable Configurations
    Systems can be tailored to specific requirements, including multiple camera setups for larger or more complex test specimens.

  • Dynamic Testing Compatibility
    Supports high-speed cameras for dynamic testing scenarios, such as impact analysis and vibration studies.

  • Ease of Use
    Features an intuitive user interface for easy setup, calibration, and operation, even for complex experiments.

  • Portable and Modular Design
    Lightweight and adaptable to various experimental setups, making it suitable for in-lab or in-field testing.

  • Seamless Integration
    Compatible with other testing equipment and data acquisition systems, ensuring streamlined workflows.

  • Advanced Post-Processing Software
    Includes powerful tools for analyzing deformation, strain, and stress with 2D or 3D visualization options.

 

LaVision’s 2D & 3D Digital Image Correlation Systems deliver unmatched accuracy, flexibility, and ease of use, making them a trusted solution for deformation and strain analysis across multiple industries. Whether for academic research, industrial testing, or quality control, these systems enable deeper insights into material behavior under stress.

LaVision: 2D & 3D Digital Image Correlation (DIC) Systems – Specifications
Core Features

  1. High Accuracy Measurements

    • Measures deformation and strain with exceptional precision, suitable for microstrains up to 1000%.

  2. Advanced Imaging Components

    • Equipped with Imager E-Lite cameras and quality lenses for optimal image capture.
    • Includes a highly efficient pulsed illumination system for clear imaging under various conditions.

  3. Mounting and Calibration

    • Ultra-rigid, lightweight mounting system ensures stability.
    • Simple setup and calibration for ease of operation.

  4. Comprehensive Software Support

    • StrainMaster DIC Software employs a Least Squares Matching (LSM) approach for accurate displacement field calculations.
    • Handles both small and large deformations with methods like differential summation and Lagrangian coordinates.
    • Provides virtual strain gauge mode for non-contacting strain measurement.
Operational Modes and Compatibility

  1. Multiple Acquisition Modes

    • Fixed frequency, manual trigger, and phase-locked acquisition.
    • Suited for high-strain rate impacts, cyclic fatigue tests, and long-term testing.

  2. Hardware Integration

    • Full hardware control through DaVis Platform.
    • Compatible with standard and high-speed cameras, data loggers, translation stages, and pulsed light sources.

  3. Phase-Locked Recording

    • Synchronizes with cyclic events (e.g., fatigue testing).
    • Enables post-triggering for high-speed events like Split-Hopkinson pressure bar tests.
Applications

  1. Strain and Deformation Analysis

    • Equivalent to thousands of gauges on the specimen surface.
    • Validates finite element simulations.

  2. Crack Growth Analysis

    • Tracks crack development and measures crack length/opening using non-speckled surfaces.

  3. Versatile Testing Environments

    • Suitable for standard conditions, harsh environments, and even submerged specimens.
    • Works in environmental chambers without damage to the setup.

  4. Non-Contact Testing

    • Eliminates the need for physical extensometers.
    • Continues operation even if specimens break.
Advantages
  • Provides live or post-processed analysis.
  • Non-contact methods reduce setup complexity and improve safety.
  • Simplifies complex acquisition loops with integrated control systems.
  • Robust performance for diverse applications, including high-speed and fatigue testing.
Applications in Research and Industry
  • Material characterization.
  • Finite element validation.
  • Fatigue and impact testing.
  • Crack growth monitoring in structural components.

This advanced DIC system sets a high standard for precision and efficiency, ideal for applications in engineering, materials science, and industrial quality control.

LaVision: 2D & 3D Digital Image Correlation (DIC) Systems Applications

The LaVision 2D & 3D Digital Image Correlation (DIC) Systems provide cutting-edge solutions for precise measurement and visualization of deformation, strain, and movement on material surfaces. These systems are widely used in research, development, and quality control across various industries due to their non-contact, full-field measurement capabilities.

 

1. Fundamental Materials Analysis
  • Testing Methods:
    • Tensile, compression, bend, fatigue, and impact testing.
    • Accurate strain and deformation measurements for fundamental material behavior studies.
  • Industries: R&D, manufacturing, and academia.
2. Component Behavior Under Loading
  • Applications:
    • Real-time observation and analysis of how components respond to mechanical loads.
    • Provides critical insights for improving product design and performance.
3. Strain Hot Spot Identification
  • Use Case:
    • Detection of high-strain regions in complex structures, enabling targeted reinforcement or redesign to prevent failure.
4. Polymers and Composites
  • Key Insights:
    • Comprehensive analysis of deformation and strain in lightweight, high-performance materials.
    • Essential for aerospace, automotive, and sports industries.
5. Flexible and Woven Materials
  • Specialty Applications:
    • Non-contact measurements for materials like textiles, woven composites, and foams under various load conditions.
  • Industries: Textile manufacturing and soft material R&D.
6. Biomedical Studies
  • Applications:
    • Analysis of biomechanical properties of tissues and synthetic devices.
    • Used in prosthetics development, surgical simulations, and biomedical device validation.
7. Automotive Engineering Materials
  • Use Cases:
    • Study of engine parts, body panels, and crash dynamics.
    • Supports durability testing and material optimization for automotive components.
8. Aerospace Component Testing
  • Applications:
    • Deflection analysis and strain mapping of aerospace parts, including wings, fuselage, and engine components.
    • Ensures reliability under extreme operational conditions.
 
 
1. What is Digital Image Correlation (DIC)?

Digital Image Correlation (DIC) is a non-contact optical measurement technique used to track and analyze displacement, deformation, and strain in 2D or 3D by comparing digital images captured before and after deformation.

LaVision DIC systems are used in:

  • Material testing (tensile, compression, and fatigue tests).
  • Aerospace (structural integrity analysis).
  • Automotive (crash testing, component stress analysis).
  • Biomechanics (soft tissue and bone studies).

Research labs for general deformation and strain measurement.

  • 2D DIC: Measures deformation on a single plane using one camera. Suitable for flat surfaces and small deformations.
  • 3D DIC: Uses two or more cameras to measure deformation on 3D objects, capturing out-of-plane movements and complex geometries.

The main components include:

  • High-resolution cameras for image capture.
  • LED or laser illumination for optimal contrast.
  • Speckle pattern generator to enhance measurement accuracy.

Davis Software Suite for data analysis and visualization.

LaVision DIC systems can analyze a wide range of materials, including metals, polymers, composites, ceramics, and biological tissues, regardless of surface texture.

LaVision systems offer a strain measurement range from micro-strain (<0.01%) to large deformations (>100%), depending on the application and system configuration.

The accuracy of LaVision systems can reach sub-micron levels for displacement and strain measurement accuracy up to 0.01%, depending on setup and calibration.

LaVision DIC systems use the DaVis Software Suite, which provides tools for:

  • Image acquisition.
  • Correlation and strain analysis.
  • 2D/3D deformation visualization.
  • Non-contact measurement prevents any interference with the specimen.
  • Measures full-field strain instead of localized points.
  • Works on irregular surfaces and complex geometries.
  • Can analyze dynamic and high-speed events.

Industries such as aerospace, automotive, manufacturing, civil engineering, and biomedical research benefit significantly from LaVision DIC systems for their high precision and versatility.

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