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Digital Image Correlation (DIC)

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A new, compact system for shape, deformation and strain analysis
Complete surface strain map during standard materials testing
Full field DIC measurements at Very High Temperatures

Digital Image Correlation (DIC) is rapidly becoming a standard non-intrusive instrument formaterials testing. LaVision‘s StrainMaster Portable is a compact and lightweight turnkey 2D and 3D DIC system for shape, deformation and strain measurement.Suitable for a huge range of applications where flexibility and portability is essential,LaVision‘s StrainMaster system is appropriate for a wide range of subject sizes.

The StrainMaster Portable software is comprehensive, accurate, fast, and very user friendly.Comprising state of the art laptop computer, highly sensitive Imager E-Lite cameras, and coldillumination system, this device is dedicated to the study and analysis of material behavior.

With vast experience in the area of scientific imaging systems and Digital Imaging Correlation(DIC), LaVision provides the ultimate in quality and performance for your materialsmeasurements needs. Comprehensive service and support is given throughout the life of theproduct via our factory trained engineers.


Features :

  • High accuracy measurements of deformation and strain
  • Sensitive Imager E-Lite cameras combined with quality lenses
  • Ultra-rigid and lightweight mounting system
  • Equivalent to thousands of gauges on the specimen surface
  • Validate finite element simulations
  • Suitable in standard and harsh environments
  • Exceptional strain range - from micro strains to 1000% strain
  • Simple setup and calibration procedure
  • High strain rate impact through to long term fatigue testing
  • Dedicated laptop computer controlling image acquisition, processing, and project management
  • Highly efficient pulsed illumination system
  • Fast and user friendly calculations
  • Fixed frequency, manual trigger, and phase locked acquisition modes
  • Virtual strain gauge mode

Applications :

  • Fundamental materials analysis i.e., tensile, compression, bend, fatigue, impact
  • Investigation of component behavior under loading
  • Identification of strain hot spots on structures
  • Polymers and composite subjects
  • Flexible and woven materials
  • Biomedical studies of tissues and synthetic devices
  • Automotive engineering materials including engine parts and body panels
  • Deflection and testing of aerospace parts

Within the StrainMaster DIC software, a Least Squares Matching (LSM) approach with subset deformation is used to match the pattern in combination with higher order spline interpolation of the grey scale images.

Usually, the displacement field is calculated relative to the specimen in its undeformed state (typically the first image in the sequence). In cases where the deformation is relatively small the pattern in image N is matched directly back to the reference image. However, for large deformations the local pattern experiences significant changes and a sum of differential approach is used whereby the pattern is matched between successive images and then summed in a Lagrangian co-ordinate system.

Full Control

The DaVis platform offers complete hardware control with no need to rely on home-made triggering or separate multiple control porgrammes. It is possible to build acquisition loops specialized timing schemes.

  • Standard and high speed cameras
  • Data loggers for analogue data acquisition
  • Translation stages
  • Pulsed light sources

Phase locked recording of cyclic events such as fatigue testing is possible with the Strain Master controller and post-triggering of high speed events such as Split-Hopkinson pressure bar test is straightforward.

Operating in live mode or as a post-process, it is possible to apply virtual strain gages to the specimen surface. This approach using optical techniques has several advantages over conventional devices:

  • Non-contacting
  • No need to choose extensometer position before the test
  • Does not get damaged if specimen breaks
  • Can be used for specimen in solutions or in environmental chambers

Crack Growth Analysis

StrainMaster includes a crack growth analysis module to identify and track crack development in materials reporting crack length and crack opening.

This module works with non-speckled surfaces and the standard StrainMaster hardware.

About Us

Measure India Corporation (MIC) was founded in the year 2006, based at Hyderabad, India, by well experienced engineers in the field of material testing. It was started with a goal to provide arguably the best possible, yet, affordable solutions for materials and components